Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8072082 | Pre-encapsulated cavity interposer | Wang Ai-Chie | 2011-12-06 |
| 7947529 | Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods | Eng Meow Koon, Chia Yong Poo, Boon Suan Jeung | 2011-05-24 |