Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008126 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Low Siu Waf, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more | 2011-08-30 |
| 7964946 | Semiconductor package having discrete components and system containing the package | Chua Swee Kwang | 2011-06-21 |
| 7947529 | Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods | Eng Meow Koon, Boon Suan Jeung, Tay Wuu Yean | 2011-05-24 |