Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008126 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Eng Meow Koon, Huang Shuang Wu +2 more | 2011-08-30 |
| 7964946 | Semiconductor package having discrete components and system containing the package | Chia Yong Poo | 2011-06-21 |