Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8065792 | Method for packaging circuits | Yong Poo Chia, Suan Jeung Boon, Eng Meow Koon, Swee Kwang Chua | 2011-11-29 |
| 8008126 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Eng Meow Koon, Chua Swee Kwang, Huang Shuang Wu +2 more | 2011-08-30 |