Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8065792 | Method for packaging circuits | Yong Poo Chia, Low Siu Waf, Suan Jeung Boon, Eng Meow Koon | 2011-11-29 |
| 7915711 | Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die | Suan Jeung Boon, Yoon Poo Chia | 2011-03-29 |
| 7863722 | Stackable semiconductor assemblies and methods of manufacturing such assemblies | — | 2011-01-04 |