Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8065792 | Method for packaging circuits | Yong Poo Chia, Low Siu Waf, Eng Meow Koon, Swee Kwang Chua | 2011-11-29 |
| 8063493 | Semiconductor device assemblies and packages | Yong Poo Chia, Meow Koon Eng, Siu Waf Low | 2011-11-22 |
| 7943422 | Wafer level pre-packaged flip chip | — | 2011-05-17 |
| 7915711 | Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die | Swee Kwang Chua, Yoon Poo Chia | 2011-03-29 |
| 7884007 | Super high density module with integrated wafer level packages | Yong Poo Chia, Siu Waf Low, Yong Loo Neo, Bok Leng Ser | 2011-02-08 |