Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884007 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Yong Loo Neo | 2011-02-08 |
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Overall (2011): #343,501 of 364,097Top 95%
1
Patents 2011