Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7884007 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Bok Leng Ser | 2011-02-08 |
YN
Yong Loo Neo
Overall (2011): #122,326 of 364,097Top 35%
1
Patents 2011