Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8065792 | Method for packaging circuits | Low Siu Waf, Suan Jeung Boon, Eng Meow Koon, Swee Kwang Chua | 2011-11-29 |
| 8063493 | Semiconductor device assemblies and packages | Suan Jeung Boon, Meow Koon Eng, Siu Waf Low | 2011-11-22 |
| 7884007 | Super high density module with integrated wafer level packages | Suan Jeung Boon, Siu Waf Low, Yong Loo Neo, Bok Leng Ser | 2011-02-08 |