Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7915711 | Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die | Swee Kwang Chua, Suan Jeung Boon | 2011-03-29 |