Issued Patents 2011
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084863 | Circuitized substrate with continuous thermoplastic support film dielectric layers | Robert M. Japp, Kostas Papathomas, Mark D. Poliks | 2011-12-27 |
| 8063315 | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate | Rabindra N. Das, Kostas Papathomas | 2011-11-22 |
| 7981245 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Donald S. Farquhar, Mark D. Poliks, Douglas O. Powell | 2011-07-19 |
| 7977034 | Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner | John M. Lauffer, James J. McNamara, Jr., Peter A. Moschak | 2011-07-12 |
| 7931830 | Dielectric composition for use in circuitized substrates and circuitized substrate including same | Robert M. Japp, Kostas Papathomas | 2011-04-26 |
| 7897877 | Capacitive substrate | Rabindra N. Das, Frank D. Egitto, John M. Lauffer, How T. Lin | 2011-03-01 |