RJ

Robert M. Japp

ET Endicott Interconnect Technologies: 2 patents #5 of 21Top 25%
📍 Vestal, NY: #12 of 51 inventorsTop 25%
🗺 New York: #1,854 of 10,473 inventorsTop 20%
Overall (2011): #71,001 of 364,097Top 20%
2
Patents 2011

Issued Patents 2011

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8084863 Circuitized substrate with continuous thermoplastic support film dielectric layers Voya R. Markovich, Kostas Papathomas, Mark D. Poliks 2011-12-27
7931830 Dielectric composition for use in circuitized substrates and circuitized substrate including same Voya R. Markovich, Kostas Papathomas 2011-04-26