Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084863 | Circuitized substrate with continuous thermoplastic support film dielectric layers | Robert M. Japp, Voya R. Markovich, Mark D. Poliks | 2011-12-27 |
| 8063315 | Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate | Rabindra N. Das, Voya R. Markovich | 2011-11-22 |
| 7931830 | Dielectric composition for use in circuitized substrates and circuitized substrate including same | Robert M. Japp, Voya R. Markovich | 2011-04-26 |