Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084863 | Circuitized substrate with continuous thermoplastic support film dielectric layers | Robert M. Japp, Voya R. Markovich, Kostas Papathomas | 2011-12-27 |
| 7981245 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Frank D. Egitto, Donald S. Farquhar, Voya R. Markovich, Douglas O. Powell | 2011-07-19 |