Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7981245 | Multi-layered interconnect structure using liquid crystalline polymer dielectric | Donald S. Farquhar, Voya R. Markovich, Mark D. Poliks, Douglas O. Powell | 2011-07-19 |
| 7897877 | Capacitive substrate | Rabindra N. Das, John M. Lauffer, How T. Lin, Voya R. Markovich | 2011-03-01 |
| 7875811 | High speed interposer | David V. Caletka | 2011-01-25 |