RD

Rabindra N. Das

ET Endicott Interconnect Technologies: 3 patents #2 of 21Top 10%
📍 Vestal, NY: #5 of 51 inventorsTop 10%
🗺 New York: #1,093 of 10,473 inventorsTop 15%
Overall (2011): #38,296 of 364,097Top 15%
3
Patents 2011

Issued Patents 2011

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
8063315 Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate Kostas Papathomas, Voya R. Markovich 2011-11-22
7897877 Capacitive substrate Frank D. Egitto, John M. Lauffer, How T. Lin, Voya R. Markovich 2011-03-01
7870664 Method of making circuitized substrate with a resistor John M. Lauffer, Vova R. Markovich 2011-01-18