JL

John M. Lauffer

ET Endicott Interconnect Technologies: 3 patents #2 of 21Top 10%
📍 Waverly, NY: #1 of 7 inventorsTop 15%
🗺 New York: #1,093 of 10,473 inventorsTop 15%
Overall (2011): #45,206 of 364,097Top 15%
3
Patents 2011

Issued Patents 2011

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
7977034 Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner Voya R. Markovich, James J. McNamara, Jr., Peter A. Moschak 2011-07-12
7897877 Capacitive substrate Rabindra N. Das, Frank D. Egitto, How T. Lin, Voya R. Markovich 2011-03-01
7870664 Method of making circuitized substrate with a resistor Rabindra N. Das, Vova R. Markovich 2011-01-18