HL

How T. Lin

ET Endicott Interconnect Technologies: 1 patents #8 of 21Top 40%
📍 Binghamton, NY: #13 of 25 inventorsTop 55%
🗺 New York: #3,659 of 10,473 inventorsTop 35%
Overall (2011): #283,468 of 364,097Top 80%
1
Patents 2011

Issued Patents 2011

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7897877 Capacitive substrate Rabindra N. Das, Frank D. Egitto, John M. Lauffer, Voya R. Markovich 2011-03-01