Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8017436 | Thin substrate fabrication method and structure | Ronald Patrick Huemoeller, Sukianto Rusli, Bob Shih-Wei Kuo, Jon Aday, Lee Smith | 2011-09-13 |
| 7932170 | Flip chip bump structure and fabrication method | Ronald Patrick Huemoeller, Roger D. St. Amand | 2011-04-26 |
| 7923645 | Metal etch stop fabrication method and structure | Ronald Patrick Huemoeller, Sukianto Rusli | 2011-04-12 |
| 7911017 | Direct glass attached on die optical module | Arsenio de Guzman, Young-Ho Kim | 2011-03-22 |
| 7898093 | Exposed die overmolded flip chip package and fabrication method | Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2011-03-01 |