Issued Patents 2011
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084868 | Semiconductor package with fast power-up cycle and method of making same | Vladimir Perelman | 2011-12-27 |
| 8072083 | Stacked electronic component package having film-on-wire spacer | ChangSuk Han, YounSang Kim, KyungRok Park, Vladimir Perelman | 2011-12-06 |
| 8058715 | Package in package device for RF transceiver module | Fernando Roa | 2011-11-15 |
| 7932170 | Flip chip bump structure and fabrication method | Ronald Patrick Huemoeller, Robert Francis Darveaux | 2011-04-26 |