Issued Patents 2011
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026587 | Semiconductor package including top-surface terminals for mounting another semiconductor package | David Jon Hiner, Sukianto Rusli | 2011-09-27 |
| 8018068 | Semiconductor package including a top-surface metal layer for implementing circuit features | Christopher M. Scanlan | 2011-09-13 |
| 8017436 | Thin substrate fabrication method and structure | Sukianto Rusli, Bob Shih-Wei Kuo, Jon Aday, Lee Smith, Robert Francis Darveaux | 2011-09-13 |
| 7994045 | Bumped chip package fabrication method and structure | Rex Anderson, Ravi Kiran Chilukuri | 2011-08-09 |
| 7977163 | Embedded electronic component package fabrication method | Sukianto Rusli, David Jon Hiner | 2011-07-12 |
| 7958626 | Embedded passive component network substrate fabrication method | Nozad Karim, Sukianto Rusli | 2011-06-14 |
| 7951697 | Embedded die metal etch stop fabrication method and structure | Sukianto Rusli | 2011-05-31 |
| 7932595 | Electronic component package comprising fan-out traces | Sukianto Rusli, David Razu | 2011-04-26 |
| 7932170 | Flip chip bump structure and fabrication method | Roger D. St. Amand, Robert Francis Darveaux | 2011-04-26 |
| 7923645 | Metal etch stop fabrication method and structure | Sukianto Rusli, Robert Francis Darveaux | 2011-04-12 |
| 7911037 | Method and structure for creating embedded metal features | Sukianto Rusli, David Jon Hiner, Nozad Karim | 2011-03-22 |