Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018068 | Semiconductor package including a top-surface metal layer for implementing circuit features | Ronald Patrick Huemoeller | 2011-09-13 |
| 7960827 | Thermal via heat spreader package and method | August Joseph Miller, Jr., Jeffrey Alan Miks, Mahmoud Dreiza | 2011-06-14 |
| 7898066 | Semiconductor device having EMI shielding and method therefor | Christopher J. Berry, Timothy L. Olson | 2011-03-01 |