Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018072 | Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate | Jui Min Lim | 2011-09-13 |
| 7960827 | Thermal via heat spreader package and method | August Joseph Miller, Jr., Christopher M. Scanlan, Mahmoud Dreiza | 2011-06-14 |