Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8018072 | Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate | Jeffrey Alan Miks | 2011-09-13 |
| 7952202 | Method of embedding passive component within via | Todd Myers, Nicholas R. Watts, Eric Palmer | 2011-05-31 |