Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8022521 | Package failure prognostic structure and method | Akito Yoshida | 2011-09-20 |
| 7960827 | Thermal via heat spreader package and method | August Joseph Miller, Jr., Jeffrey Alan Miks, Christopher M. Scanlan | 2011-06-14 |