Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8030722 | Reversible top/bottom MEMS package | David Bolognia, Bud Troche | 2011-10-04 |
| 8017436 | Thin substrate fabrication method and structure | Ronald Patrick Huemoeller, Sukianto Rusli, Jon Aday, Lee Smith, Robert Francis Darveaux | 2011-09-13 |
| 7915715 | System and method to provide RF shielding for a MEMS microphone package | Nozad Karim, Jingkun Mao | 2011-03-29 |