Issued Patents 2011
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8026587 | Semiconductor package including top-surface terminals for mounting another semiconductor package | David Jon Hiner, Ronald Patrick Huemoeller | 2011-09-27 |
| 8017436 | Thin substrate fabrication method and structure | Ronald Patrick Huemoeller, Bob Shih-Wei Kuo, Jon Aday, Lee Smith, Robert Francis Darveaux | 2011-09-13 |
| 7977163 | Embedded electronic component package fabrication method | Ronald Patrick Huemoeller, David Jon Hiner | 2011-07-12 |
| 7958626 | Embedded passive component network substrate fabrication method | Nozad Karim, Ronald Patrick Huemoeller | 2011-06-14 |
| 7951697 | Embedded die metal etch stop fabrication method and structure | Ronald Patrick Huemoeller | 2011-05-31 |
| 7932595 | Electronic component package comprising fan-out traces | Ronald Patrick Huemoeller, David Razu | 2011-04-26 |
| 7923645 | Metal etch stop fabrication method and structure | Ronald Patrick Huemoeller, Robert Francis Darveaux | 2011-04-12 |
| 7911037 | Method and structure for creating embedded metal features | Ronald Patrick Huemoeller, David Jon Hiner, Nozad Karim | 2011-03-22 |