Issued Patents 2011
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7898093 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Ki Wook Lee +1 more | 2011-03-01 |