Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7919853 | Semiconductor package and fabrication method thereof | — | 2011-04-05 |
| 7898093 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park +1 more | 2011-03-01 |
| 7872341 | Semiconductor device | Sang Jae Jang, Jae Dong Kim | 2011-01-18 |