Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7982298 | Package in package semiconductor device | Dae Byoung Kang, Sung Jin Yang, Jung Tae Ok | 2011-07-19 |
| 7898093 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Miguel A. Jimarez, Dae Keun Park, Ki Wook Lee +1 more | 2011-03-01 |
| 7872341 | Semiconductor device | Sang Jae Jang, Ki Wook Lee | 2011-01-18 |