Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6943077 | Selective spacer layer deposition method for forming spacers with different widths | Ai-Sen Liu, Baw-Ching Perng, Yih-Shung Lin, Cheng-Chung Lin, Chia-Hui Lin | 2005-09-13 |
| 6917119 | Low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ching-Cheng Huang, Chuen-Jye Lin | 2005-07-12 |