Issued Patents 2005
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6917119 | Low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ming-Ta Lei, Ching-Cheng Huang | 2005-07-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6917119 | Low fabrication cost, high performance, high reliability chip scale package | Jin-Yuan Lee, Ming-Ta Lei, Ching-Cheng Huang | 2005-07-12 |