Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6936531 | Process of fabricating a chip structure | Mou-Shiung Lin, Ching-Cheng Huang | 2005-08-30 |
| 6917119 | Low fabrication cost, high performance, high reliability chip scale package | Ming-Ta Lei, Ching-Cheng Huang, Chuen-Jye Lin | 2005-07-12 |