Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6955984 | Surface treatment of metal interconnect lines | Wen-Kai Wan, Yih-Hsiung Lin, Ming LEI, Baw-Ching Perng, Chia-Hui Lin +1 more | 2005-10-18 |
| 6943077 | Selective spacer layer deposition method for forming spacers with different widths | Ai-Sen Liu, Baw-Ching Perng, Ming-Ta Lei, Yih-Shung Lin, Chia-Hui Lin | 2005-09-13 |