Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6955984 | Surface treatment of metal interconnect lines | Wen-Kai Wan, Yih-Hsiung Lin, Ming LEI, Baw-Ching Perng, Cheng-Chung Lin +1 more | 2005-10-18 |
| 6943077 | Selective spacer layer deposition method for forming spacers with different widths | Ai-Sen Liu, Baw-Ching Perng, Ming-Ta Lei, Yih-Shung Lin, Cheng-Chung Lin | 2005-09-13 |
| 6875655 | Method of forming DRAM capacitors with protected outside crown surface for more robust structures | Chun-Chieh Lin, Lan-Lin Chao, Fu-Liang Yang, Chia-Shiung Tsai, Chanming Hu | 2005-04-05 |