Issued Patents 2005
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6958296 | CVD TiSiN barrier for copper integration | Ling Chen, Hyungsuk Alexander Yoon | 2005-10-25 |
| 6953742 | Tantalum barrier layer for copper metallization | Ling Chen, Seshadri Ganguli, Wei Cao | 2005-10-11 |
| 6905541 | Method and apparatus of generating PDMAT precursor | Ling Chen, Vincent Ku, Hua Chung, Seshadri Ganguli, Jenny Lin +3 more | 2005-06-14 |