Issued Patents 2005
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6972267 | Sequential deposition of tantalum nitride using a tantalum-containing precursor and a nitrogen-containing precursor | Hua Chung, Vincent Ku, Ling Chen | 2005-12-06 |
| 6953742 | Tantalum barrier layer for copper metallization | Ling Chen, Seshadri Ganguli, Christophe Marcadal | 2005-10-11 |