Issued Patents 2003
Showing 1–25 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667546 | Ball grid array semiconductor package and substrate without power ring or ground ring | Eric Ko, Chih-Ming Huang | 2003-12-23 |
| 6664649 | Lead-on-chip type of semiconductor package with embedded heat sink | — | 2003-12-16 |
| 6661089 | Semiconductor package which has no resinous flash formed on lead frame and method for manufacturing the same | — | 2003-12-09 |
| 6657296 | Semicondctor package | Tzong-Da Ho | 2003-12-02 |
| 6650006 | Semiconductor package with stacked chips | Tzong-Da Ho, Cheng-Hsu Hsiao | 2003-11-18 |
| 6650009 | Structure of a multi chip module having stacked chips | Tzong-Dar Her, Randy H. Y. Lo | 2003-11-18 |
| 6646349 | Ball grid array semiconductor package | Han-Ping Pu | 2003-11-11 |
| 6643919 | Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame | — | 2003-11-11 |
| 6639306 | Semiconductor package having a die pad with downward-extended tabs | — | 2003-10-28 |
| 6635209 | Method of encapsulating a substrate-based package assembly without causing mold flash | — | 2003-10-21 |
| 6630729 | Low-profile semiconductor package with strengthening structure | — | 2003-10-07 |
| 6621150 | Lead frame adaptable to the trend of IC packaging | Yvonne Lee, Han-Ping Pu | 2003-09-16 |
| 6593662 | Stacked-die package structure | Han-Ping Pu, Randy H. Y. Lo, Tzong-Dar Her, Cheng-Shiu Hsiao, Chi-Chuan Wu | 2003-07-15 |
| 6593658 | Chip package capable of reducing moisture penetration | Chih-Chin Liao, Yung-Kang Chu | 2003-07-15 |
| 6590281 | Crack-preventive semiconductor package | Chi-Chuan Wu | 2003-07-08 |
| 6583499 | Quad flat non-leaded package and leadframe for use in a quad flat non-leaded package | Tzong-Dar Her | 2003-06-24 |
| 6570249 | Semiconductor package | Chih-Chin Liao, Han-Ping Pu | 2003-05-27 |
| 6559525 | Semiconductor package having heat sink at the outer surface | — | 2003-05-06 |
| 6555902 | Multiple stacked-chip packaging structure | Randy H. Y. Lo, Chi-Chuan Wu | 2003-04-29 |
| 6552428 | Semiconductor package having an exposed heat spreader | Tom Tang, Kevin Chiang, Jenq-Yuan Lai, Candy Tien, Vicky Liu | 2003-04-22 |
| 6548911 | Multimedia chip package | Kevin Yu, Che-Jung Chang | 2003-04-15 |
| 6543128 | Ball grid array package and its fabricating process | Grace Yang | 2003-04-08 |
| 6545332 | Image sensor of a quad flat package | — | 2003-04-08 |
| 6541307 | Multimedia chip package | Kevin Yu, Che-Jung Chang | 2003-04-01 |
| 6541870 | Semiconductor package with stacked chips | Tzong-Da Ho, Cheng-Hsu Hsiao | 2003-04-01 |