Issued Patents 2003
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6661087 | Lead frame and flip chip semiconductor package with the same | — | 2003-12-09 |
| 6611434 | Stacked multi-chip package structure with on-chip integration of passive component | Randy H. Y. Lo, Tzong-Da Ho | 2003-08-26 |
| 6602737 | Semiconductor package with heat-dissipating structure and method of making the same | — | 2003-08-05 |
| 6593662 | Stacked-die package structure | Han-Ping Pu, Randy H. Y. Lo, Tzong-Dar Her, Chien-Ping Huang, Cheng-Shiu Hsiao | 2003-07-15 |
| 6590281 | Crack-preventive semiconductor package | Chien-Ping Huang | 2003-07-08 |
| 6555902 | Multiple stacked-chip packaging structure | Randy H. Y. Lo, Chien-Ping Huang | 2003-04-29 |
| 6541310 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Randy H. Y. Lo | 2003-04-01 |
| 6538321 | Heat sink with collapse structure and semiconductor package with heat sink | Chien-Ping Huang, Jui-Yu Chuang, Lien-Chi Chan | 2003-03-25 |
| 6507098 | Multi-chip packaging structure | Randy H. Y. Lo | 2003-01-14 |
| 6507120 | Flip chip type quad flat non-leaded package | Randy H. Y. Lo | 2003-01-14 |