Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650009 | Structure of a multi chip module having stacked chips | Randy H. Y. Lo, Chien-Ping Huang | 2003-11-18 |
| 6593662 | Stacked-die package structure | Han-Ping Pu, Randy H. Y. Lo, Chien-Ping Huang, Cheng-Shiu Hsiao, Chi-Chuan Wu | 2003-07-15 |
| 6583499 | Quad flat non-leaded package and leadframe for use in a quad flat non-leaded package | Chien-Ping Huang | 2003-06-24 |
| 6541854 | Super low profile package with high efficiency of heat dissipation | Chien-Ping Huang | 2003-04-01 |
| 6525942 | Heat dissipation ball grid array package | Chien-Ping Huang | 2003-02-25 |