Issued Patents 2003
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650009 | Structure of a multi chip module having stacked chips | Tzong-Dar Her, Chien-Ping Huang | 2003-11-18 |
| 6611434 | Stacked multi-chip package structure with on-chip integration of passive component | Tzong-Da Ho, Chi-Chuan Wu | 2003-08-26 |
| 6593662 | Stacked-die package structure | Han-Ping Pu, Tzong-Dar Her, Chien-Ping Huang, Cheng-Shiu Hsiao, Chi-Chuan Wu | 2003-07-15 |
| 6555902 | Multiple stacked-chip packaging structure | Chien-Ping Huang, Chi-Chuan Wu | 2003-04-29 |
| 6541310 | Method of fabricating a thin and fine ball-grid array package with embedded heat spreader | Chi-Chuan Wu | 2003-04-01 |
| 6528722 | Ball grid array semiconductor package with exposed base layer | Chien-Ping Huang | 2003-03-04 |
| 6507098 | Multi-chip packaging structure | Chi-Chuan Wu | 2003-01-14 |
| 6507120 | Flip chip type quad flat non-leaded package | Chi-Chuan Wu | 2003-01-14 |