Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6646349 | Ball grid array semiconductor package | Chien-Ping Huang | 2003-11-11 |
| 6621150 | Lead frame adaptable to the trend of IC packaging | Yvonne Lee, Chien-Ping Huang | 2003-09-16 |
| 6610560 | Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same | Yu-Po Wang, Caesar Lin | 2003-08-26 |
| 6593662 | Stacked-die package structure | Randy H. Y. Lo, Tzong-Dar Her, Chien-Ping Huang, Cheng-Shiu Hsiao, Chi-Chuan Wu | 2003-07-15 |
| 6580618 | Low-profile multi-chip module | — | 2003-06-17 |
| 6570249 | Semiconductor package | Chih-Chin Liao, Chien-Ping Huang | 2003-05-27 |
| 6555924 | Semiconductor package with flash preventing mechanism and fabrication method thereof | Ting-Ke Chai, Po Yuan | 2003-04-29 |