Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650015 | Cavity-down ball grid array package with semiconductor chip solder ball | Eing-Chieh Chen, Shiu-Tai Tzung, Jeng-Yuan Lai, Candy Tien | 2003-11-18 |
| 6555924 | Semiconductor package with flash preventing mechanism and fabrication method thereof | Po Yuan, Han-Ping Pu | 2003-04-29 |