Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650015 | Cavity-down ball grid array package with semiconductor chip solder ball | Eing-Chieh Chen, Ting-Ke Chai, Jeng-Yuan Lai, Candy Tien | 2003-11-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6650015 | Cavity-down ball grid array package with semiconductor chip solder ball | Eing-Chieh Chen, Ting-Ke Chai, Jeng-Yuan Lai, Candy Tien | 2003-11-18 |