Issued Patents 2003
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6657296 | Semicondctor package | Chien-Ping Huang | 2003-12-02 |
| 6650006 | Semiconductor package with stacked chips | Chien-Ping Huang, Cheng-Hsu Hsiao | 2003-11-18 |
| 6611434 | Stacked multi-chip package structure with on-chip integration of passive component | Randy H. Y. Lo, Chi-Chuan Wu | 2003-08-26 |
| 6541870 | Semiconductor package with stacked chips | Chien-Ping Huang, Cheng-Hsu Hsiao | 2003-04-01 |
| 6507104 | Semiconductor package with embedded heat-dissipating device | Chien-Ping Huang | 2003-01-14 |