Issued Patents 2003
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6541854 | Super low profile package with high efficiency of heat dissipation | Tzong-Dar Her | 2003-04-01 |
| 6538321 | Heat sink with collapse structure and semiconductor package with heat sink | Chi-Chuan Wu, Jui-Yu Chuang, Lien-Chi Chan | 2003-03-25 |
| 6528876 | Semiconductor package having heat sink attached to substrate | — | 2003-03-04 |
| 6528722 | Ball grid array semiconductor package with exposed base layer | Randy H. Y. Lo | 2003-03-04 |
| 6525942 | Heat dissipation ball grid array package | Tzong-Dar Her | 2003-02-25 |
| 6521997 | Chip carrier for accommodating passive component | Wei-Chen Tseng, Yu-Ting Lai | 2003-02-18 |
| 6507121 | Array structure of solder balls able to control collapse | — | 2003-01-14 |
| 6507104 | Semiconductor package with embedded heat-dissipating device | Tzong-Da Ho | 2003-01-14 |