Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667546 | Ball grid array semiconductor package and substrate without power ring or ground ring | Chien-Ping Huang, Chih-Ming Huang | 2003-12-23 |
| 6555296 | Fine pitch wafer bumping process | Raymond Jao, Alex Yang | 2003-04-29 |