Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645550 | Method of treating a substrate | Robin Cheung, Jennifer Meng Chu Tseng | 2003-11-11 |
| 6635157 | Electro-chemical deposition system | Donald Olgado, Ratson Morad, Peter Hey, Mark Denome, Michael Sugarman +10 more | 2003-10-21 |
| 6613214 | Electric contact element for electrochemical deposition system and method | Joseph Stevens | 2003-09-02 |
| 6599402 | Electro-chemical deposition cell for face-up processing of single semiconductor substrates | Joe Stevens, Roy Edwards, Bob Lowrance, Michael Sugarman, Mark Denome | 2003-07-29 |
| 6585876 | Flow diffuser to be used in electro-chemical plating system and method | Joseph Stevens, H. Peter W. Hey, Donald Olgado | 2003-07-01 |
| 6582578 | Method and associated apparatus for tilting a substrate upon entry for metal deposition | Joseph Stevens, Michael Sugarman | 2003-06-24 |
| 6572010 | Integrated solder bump deposition apparatus and method | Robin Cheung | 2003-06-03 |
| 6551484 | Reverse voltage bias for electro-chemical plating system and method | H. Peter W. Hey | 2003-04-22 |
| 6521102 | Perforated anode for uniform deposition of a metal layer | — | 2003-02-18 |