Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653267 | Aqueous dispersion for chemical mechanical polishing used for polishing of copper | Gaku Minamihaba, Masayuki Motonari, Masayuki Hattori, Nobuo Kawahashi | 2003-11-25 |
| 6609950 | Method for polishing a substrate | Norio Kimura, Yu Ishii, Hirokuni Hiyama, Katsuya Okumura | 2003-08-26 |
| 6610629 | Process for producing an oxide catalyst for oxidation or ammoxidation | Hidenori Hinago | 2003-08-26 |
| 6611060 | Semiconductor device having a damascene type wiring layer | Hiroshi Toyoda, Gaku Minamihaba, Dai Fukushima, Tetsuo Matsuda, Hisashi Kaneko | 2003-08-26 |
| 6576554 | Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process | Yukiteru Matsui, Gaku Minamihaba, Dai Fukushima | 2003-06-10 |
| 6544804 | Semiconductor wafer having identification indication and method of manufacturing the same | Katsuya Okumura | 2003-04-08 |