Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6653267 | Aqueous dispersion for chemical mechanical polishing used for polishing of copper | Hiroyuki Yano, Masayuki Motonari, Masayuki Hattori, Nobuo Kawahashi | 2003-11-25 |
| 6611060 | Semiconductor device having a damascene type wiring layer | Hiroshi Toyoda, Hiroyuki Yano, Dai Fukushima, Tetsuo Matsuda, Hisashi Kaneko | 2003-08-26 |
| 6576554 | Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process | Yukiteru Matsui, Hiroyuki Yano, Dai Fukushima | 2003-06-10 |